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Brooks' and Adam's new book:

Trace temperatures are important. Via temperatures are even more important. Read why designers can use significantly fewer vias than previously believed. Read why current density should never be considered when thinking about trace and via temperatures. Learn about the dynamics of fusing when traces melt; sometimes with a whimper and sometimes with a bang!

Traces do not heat uniformly along their length. They don't even heat uniformly from their center to their edge. Learn why in this very detailed and informative book. This is a must-have book in every designer's library

 

A Table of Contents is provided below.


Buy from Artech House, or

from Amazon

 

   
Table of Contents Table of Contents
 
Preface
Acknowledgement
Technical Note
 
1: Introduction and Historical Background
            1.1 Bottom Line
            1.2 Historical Background
            1.3 A Note About Consistency
2: Materials Used in PCB
            2.1 Bottom Line
            2.2 Background
            2.3 Copper Used in PCBs
            2.4 Dielectrics Used in PCBs
3: Resistivity and Resistance
            3.1 Bottom Line
            3.2 Resistivity
            3.3 Resistance
            3.4 Thermal Coefficient of Resistivity
            3.5 Measuring Resistivity
4: Trace Heating and Cooling
            4.1 Bottom Line
            4.2 Overview
            4.3 Trace Heating
            4.4 Trace Cooling
            4.5 Mathematical Model of Trace Heating and Cooling
            4.6 Role of Current Density
            4.7 Measuring Trace Temperature
            4.8 Trace Temperature Curves
5: IPC Curves
            5.1 Bottom Line
            5.2 IPC-2152
            5.3 Measuring the Temperature
            5.4 IPC Curves
6: Thermal Simulation Model
            6.1 Bottom Line
            6.2 Background
            6.3 Modeling Traces
            6.4 Modeling Process
7: Thermal Simulations
            7.1 Bottom Line
            7.2 Sensitivities: Layout Parameters
            7.3 Sensitivities: Material Parameters
            7.4 Sensitivities: Trace Depth
            7.5 Conclusions
8: Via Temperatures
            8.1 Bottom Line
            8.2 Background Information
            8.3 Thermal Simulation
            8.4 Experimental Verification
            8.5 Experimental Results
            8.6 Voltage Drops Across Traces and Vias
            8.7 Thermal Vias
9: Current Densities in Vias
            9.1 Bottom Line
            9.2 Background
            9.3 Single Via
            9.4 Multiple Vias
            9.5 Multiple Vias and Turn
            9.6 Conclusions
10: Thinking Outside the Box
            10.1 Bottom Line
            10.2 Start Thinking “Outside the Box”
            10.3 Test Board
            10.4 Copper Under the Trace
            10.5 Adding Additional Copper to Traces
            10.6 Dealing With Connecting Links
            10.7 Conclusions
11: Fusing Currents; Background
            11.1 Bottom Line
            11.2 Background
            11.3 W. H. Preece
            11.4 I. M. Onderdonk
12: Fusing Currents; Analyses
            12.1 Bottom Line
            12.2 Background
            12.3 Fusing Time and Temperature
            12.4 Assumptions and Cautions
            12.5 Simulation Models
            12.6 Experimental Results
            12.7 The Fusing Process
            12.8 Experimental Results
            12.9 Summary
13: Do Traces Heat Uniformly
            13.1 Bottom Line
            13.2 Background
            13.3 Thermal Gradients on Traces
            13.4 Thermal Gradients Around Corners
14: Relevance of Current Density
            14.1 Bottom Line
            14.2 Background
            14.3 Current Density is Not an Independent Variable
            14.4 IPC Curves
            14.5 Copper Type
            14.6 Dielectric Type
            14.7 Right-Angle Corners
            14.8 Trace Form Factor
            14.9 Via Current Densities
            14.10 Conclusion
15: AC Currents
            15.1 Bottom Line
            15.2 Digital Simulation Models
            15.3 Experimental Verification
            15.4 Analog AC Currents
16: Industrial CT Scanning
            16.1 Bottom Line
            16.2 Background
            16.3 The Promise
            16.4 The Microsectioning Process
            16.5 Industrial CT Scanning
            16.6 Comparison of the Processes
            16.7 Conclusion
 
Appendices
A: Measuring Thermal Conductivity
B: Measuring Resistivity
C: Internal and Vacuum Curves
D: Detailed Sets of Equations
E: Current/Temperature Curves: ¼ to 5 Oz.
F: Via Current Density
G: Derivation of Onderdonk’s Equation
H: Fusing Current Simulations
I: Non-Uniform Heating Patterns