|UltraCAD Design, Inc|
PCB Trace and Via
Currents and Temperatures
The Complete Analysis
Finally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures. All in one place!
|Brooks has been looking at these relationships since the mid '90s.
And he has assembled 20-plus years of knowledge into these pages.
Starting with a historical background, this book covers: (a) PCB
materials (copper and dielectrics) and the role they play in the heating
and cooling of traces; (b) The IPC curves found in IPC 2152; (c)
Equations that fit those curves; (d) Computer simulations that fit those
curves and equations; (e) Sensitivity analyses showing what happens when
we vary the environment (adjacent traces and planes, changing trace
lengths, thermal gradients, etc.); (f) Via temperatures and what
determines them; (g) Via current densities; and (h) Fusing issues, what
happens when traces are overloaded. There are supplemental chapters or
appendices on measuring the thermal conductivity of dielectrics and
measuring the resistivity of copper traces (and why many prior attempts
to do so have been doomed to failure.) And there is even a chapter on
whether Industrial CT Scanning might replace microsections for measuring
Never before has such a thorough compendium been available, especially so conveniently.
|To see the Errata page, look here:|
|To see a Table of Contents, look here:|
|To order a copy, go here.|
|To see figures in the Gallery, look here.|
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